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Japanese Top Page Corporate Information Product Divisions Product Divisions   The past several years have seen rapidly expanding application of chip-sized packages (CSPs) due to their facilitating the creation of smaller and lighter portable information equipment. Citizen Miyota is also engaged in packaging of multi-chip modules (MCMs), which have made higher-performance and higher-density packaging a reality. Every one of these high-density packaging operations are being carried out in the cleanest possible environment using the most demanding "clean technology." Copyright(c) CITIZEN MIYOTA 2005 Allrights Reserved.